GIGABYTE teases what may be the most extreme consumer motherboard ever

At its pre-Computex 2026 press conference, GIGABYTE unveiled what may be the most over-the-top consumer motherboard ever created. The GIGABYTE X870E AORUS Infinity Next features a space-age design - and we mean that literally.

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The board features a 3D-printed honeycomb heatsink structure made of what GIGABYTE refers to as 'rocket thruster-grade thermal materials'. When I talked to a GIGABYTE representative, I was told that this alone costs well into four figures, and it takes two days to print. For each board! It goes without saying that this will be a very limited edition board that will cost thousands of dollars. The primary M.2 heatsink is no less impressive, featuring more cooling area than some boards' VRM heatsinks.

That's not the only over-the-top feature. It's got a cutting-edge VRM that combines multiple stages into one. To use the common phase count parlance. It has a 64-phase VRM capable of delivering over 5000 Amperes of current. Crazy stuff!

Further specifications weren't revealed, but it's safe to say this board will have the lot. It looks like it's inspired a little by the AORUS Tachyon, as it has dual RAM slots, so we can expect it to have a heavy emphasis on overclocking.

Whether this board ever ends up on store shelves or not - even as a proof of concept, I say good on you GIGABYTE for pushing the envelope. Perhaps in the future, such designs might flow down to models for buyers on planet Earth. We expect to see the board in person when we tour GIGABYTE's booth at Computex 2026, which officially kicks off on June 2.